Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications

New Journal of Chemistry Pub Date: 2015-06-19 DOI: 10.1039/C5NJ00364D

Abstract

The present study is focused on the synthesis and characterization of flame retardant amine-terminated cyclophosphazene and silane functionalized rice husk ash reinforced benzoxazine blended epoxy composites as a halogen-free flame retardant material (ATCP/FRHA/Bz-Ep). FT-IR spectroscopy, scanning electron microscopy (SEM), X-ray diffraction analysis, contact angle measurements, dielectric constant, DSC, TGA, UL-94, LOI and cone calorimetry were used to characterize the surface morphology as well as the structural, electrical, thermal and flame retardant properties of the resultant ATCP/FRHA/Bz-Ep composite material. The experimental results suggested that ATCP/FRHA/Bz-Ep composites exhibit better flame retardant and dielectric performance compared to that of a neat Bz–Ep material. A plausible mechanism of the fire retardant ATCP/FRHA/Bz-Ep composite material is hypothesized based on the results of cone calorimetric, thermal and electrical analysis. From the abovementioned results, it was concluded that the ATCP/FRHA/Bz-Ep composite can be used as an electrical resistant material for electronic and microelectronic applications.

Graphical abstract: Development of halogen-free flame retardant phosphazene and rice husk ash incorporated benzoxazine blended epoxy composites for microelectronic applications
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