Metalloid salts
Metalloid salts represent a unique class of compounds that combine the properties of both metals and nonmetals, making them intriguing for various applications in chemistry and materials science. These salts are formed when metalloids such as boron (B), silicon (Si), arsenic (As), antimony (Sb), or tellurium (Te) interact with metallic or non-metallic elements. They exhibit a wide range of physical properties, including conductivity that can vary between insulating and semi-conducting behaviors.
For instance, metalloid salts derived from boron are known for their semiconductor characteristics, which make them essential in the development of electronic devices such as transistors and solar cells. On the other hand, silicon-based metalloids play a crucial role in the production of high-quality semiconductors used in modern electronics.
Moreover, these compounds can also be employed in catalysis, where their unique chemical properties facilitate efficient reactions under mild conditions. Metalloid salts’ ability to form complexes with various ligands further expands their potential applications in fields like pharmaceuticals and environmental remediation. Their diverse properties and functionalities make metalloid salts a vital component in the advancement of material science and technological innovations.
| Structure | Chemical Name | CAS | MF |
|---|---|---|---|
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Tin(II)telluride | 12040-02-7 | SnTe |
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Zirconium Boride | 12045-64-6 | B2Zr |
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dinickel silicide | 12059-14-2 | Ni2Si |
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Mercury(II) telluride | 12068-90-5 | HgTe |
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Tungsten telluride (WTe2) | 12067-76-4 | Te2W |
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Molybdenum boride(MoB2) | 12007-27-1 | B2Mo |
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CHROMIUM SILICIDE | 12134-19-9 | CR |
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Tungsten boride (W2B) | 12007-10-2 | BW2 |
Related Literature
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Hanie Hashtroudi,Ian D. R. Mackinnon J. Mater. Chem. C, 2020,8, 13108-13126
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Partha Laskar,Christine Dufès Nanoscale Adv., 2021,3, 6007-6026
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Xiaoming Liu,Zachary D. Hood,Wangda Li,Donovan N. Leonard,Arumugam Manthiram,Miaofang Chi J. Mater. Chem. A, 2021,9, 2111-2119
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Brindha J.,Balamurali M. M.,Kaushik Chanda RSC Adv., 2019,9, 34720-34734
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