Cas no 775-56-4 (Diethoxy(methyl)phenylsilane)
Diethoxy(methyl)phenylsilane Chemical and Physical Properties
Names and Identifiers
-
- Diethoxymethylphenylsilane
- Methylphenyldiethoxysilane
- Phenylmethyldiethoxysilane
- Diethoxy(methyl)phenylsilane
- diethoxy-methyl-phenylsilane
- Diethoxy(methyl)(phenyl)silane
- Silane, diethoxymethylphenyl-
- Benzene, (diethoxymethylsilyl)-
- MNFGEHQPOWJJBH-UHFFFAOYSA-N
- PubChem10811
- Methyl-phenyl-diethoxysilane
- diethoxy-methyl-phenyl-silane
- Diethoxy(methyl)phenylsilane, 97%
- TRA0075318
- AK162580
- A839134
- CS-W020892
- AS-60175
- FT-0624760
- SY057095
- D90221
- MFCD00048541
- EINECS 212-275-6
- D3760
- C11H18O2Si
- 775-56-4
- AKOS015838816
- Q63409710
- SCHEMBL103755
- DTXSID30870773
- (Diethoxymethylsilyl)benzene
- DB-056230
- DTXCID501774778
-
- MDL: MFCD00048541
- Inchi: 1S/C11H18O2Si/c1-4-12-14(3,13-5-2)11-9-7-6-8-10-11/h6-10H,4-5H2,1-3H3
- InChI Key: MNFGEHQPOWJJBH-UHFFFAOYSA-N
- SMILES: [Si](C)(C1C=CC=CC=1)(OCC)OCC
- BRN: 2938396
Computed Properties
- Exact Mass: 210.10800
- Monoisotopic Mass: 210.107606
- Isotope Atom Count: 0
- Hydrogen Bond Donor Count: 0
- Hydrogen Bond Acceptor Count: 2
- Heavy Atom Count: 14
- Rotatable Bond Count: 5
- Complexity: 149
- Covalently-Bonded Unit Count: 1
- Defined Atom Stereocenter Count: 0
- Undefined Atom Stereocenter Count : 0
- Defined Bond Stereocenter Count: 0
- Undefined Bond Stereocenter Count: 0
- Topological Polar Surface Area: 18.5
- Surface Charge: 0
- Tautomer Count: nothing
- XLogP3: nothing
Experimental Properties
- Color/Form: Not determined
- Density: 0.963?g/mL?at 25?°C(lit.)
- Melting Point: <0°C
- Boiling Point: 218°C(lit.)
- Flash Point: Degrees Fahrenheit:192.2°F
Degrees Celsius:89°C - Refractive Index: n20/D 1.47(lit.)
- PSA: 18.46000
- LogP: 2.03860
- Sensitiveness: Moisture Sensitive
- Solubility: Not determined
Diethoxy(methyl)phenylsilane Security Information
-
Symbol:
- Prompt:warning
- Signal Word:Warning
- Hazard Statement: H315,H319,H335
- Warning Statement: P261,P305+P351+P338
- Hazardous Material transportation number:NA 1993 / PGIII
- WGK Germany:3
- Hazard Category Code: 36/37/38
- Safety Instruction: S26
- FLUKA BRAND F CODES:10-21
-
Hazardous Material Identification:
- TSCA:Yes
- Risk Phrases:R36/37/38
- Safety Term:S26
- Storage Condition:Store at 4°C,-4At ℃Store…Better
Diethoxy(methyl)phenylsilane Pricemore >>
| Related Categories | No. | Product Name | Cas No. | Purity | Specification | Price | update time | Inquiry |
|---|---|---|---|---|---|---|---|---|
| Fluorochem | S06255-25g |
Diethoxymethylphenylsilane |
775-56-4 | 95+% | 25g |
£90.00 | 2022-02-28 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | D122440-100g |
Diethoxy(methyl)phenylsilane |
775-56-4 | 97% | 100g |
¥599.90 | 2023-09-03 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | D122440-10g |
Diethoxy(methyl)phenylsilane |
775-56-4 | 97% | 10g |
¥97.90 | 2023-09-03 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | D122440-50g |
Diethoxy(methyl)phenylsilane |
775-56-4 | 97% | 50g |
¥377.90 | 2023-09-03 | |
| Chemenu | CM138174-500g |
Diethoxy(methyl)(phenyl)silane |
775-56-4 | 95% | 500g |
$805 | 2021-06-17 | |
| Alichem | A019113726-500g |
Diethoxy(methyl)(phenyl)silane |
775-56-4 | 95% | 500g |
$929.88 | 2023-09-01 | |
| TRC | D442163-250mg |
Diethoxy(methyl)phenylsilane |
775-56-4 | 250mg |
$ 50.00 | 2022-04-29 | ||
| TRC | D442163-500mg |
Diethoxy(methyl)phenylsilane |
775-56-4 | 500mg |
$ 65.00 | 2022-04-29 | ||
| TRC | D442163-2.5g |
Diethoxy(methyl)phenylsilane |
775-56-4 | 2.5g |
$ 80.00 | 2022-04-29 | ||
| XI GE MA AO DE LI QI ( SHANG HAI ) MAO YI Co., Ltd. | 448605-10ML |
Diethoxy(methyl)phenylsilane |
775-56-4 | 10ml |
¥767.68 | 2023-12-06 |
Diethoxy(methyl)phenylsilane Suppliers
Diethoxy(methyl)phenylsilane Related Literature
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Ni-Na Sun,Fengli Qu,Xiaobing Zhang,Shufang Zhang,Jinmao You Analyst, 2015,140, 1827-1831
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Huabin Zhang,Shaowu Du CrystEngComm, 2014,16, 4059-4068
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Chandran Rajendran,Govindaswamy Satishkumar,Charlotte Lang,Eric M. Gaigneaux Catal. Sci. Technol., 2020,10, 2583-2592
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Li-Hua Gan,Rui Wu,Jian-Lei Tian,Patrick W. Fowler Phys. Chem. Chem. Phys., 2017,19, 419-425
Additional information on Diethoxy(methyl)phenylsilane
Diethoxy(methyl)phenylsilane (CAS No. 775-56-4): A Versatile Organosilicon Compound for Modern Applications
Diethoxy(methyl)phenylsilane (CAS No. 775-56-4) is a highly valuable organosilicon compound widely used in industrial and research applications. This compound belongs to the family of alkoxysilanes, which are known for their reactivity and versatility in surface modification, adhesion promotion, and polymer synthesis. With the increasing demand for advanced materials in electronics, coatings, and pharmaceuticals, Diethoxy(methyl)phenylsilane has gained significant attention due to its unique chemical properties and broad utility.
The molecular structure of Diethoxy(methyl)phenylsilane consists of a silicon atom bonded to two ethoxy groups, a methyl group, and a phenyl ring. This configuration allows the compound to serve as an effective coupling agent, crosslinker, or precursor in various chemical processes. Researchers and manufacturers frequently search for terms like "Diethoxy(methyl)phenylsilane synthesis", "CAS 775-56-4 applications", and "phenylsilane derivatives", highlighting its relevance in modern chemistry.
One of the key applications of Diethoxy(methyl)phenylsilane is in the field of surface treatment. The compound is often used to modify glass, metal, or ceramic surfaces, improving adhesion and durability in coatings and composites. Industries such as automotive, aerospace, and construction benefit from its ability to enhance material performance under extreme conditions. Additionally, its compatibility with sol-gel processes makes it a preferred choice for producing hybrid organic-inorganic materials with tailored properties.
Another growing area of interest is the use of Diethoxy(methyl)phenylsilane in electronics and semiconductor manufacturing. With the rise of flexible electronics and wearable devices, researchers are exploring silane-based compounds for thin-film deposition and encapsulation. The compound's ability to form stable silicon-oxygen networks makes it suitable for dielectric layers and protective coatings in microelectronics. Searches related to "silane precursors for electronics" and "organosilicon compounds in semiconductors" reflect this emerging trend.
In the pharmaceutical and agrochemical sectors, Diethoxy(methyl)phenylsilane serves as an intermediate in the synthesis of bioactive molecules. Its reactivity allows for the introduction of silicon-containing functional groups, which can influence the pharmacokinetics and stability of drug compounds. Recent studies have also investigated its potential in controlled-release formulations and biocompatible materials, aligning with the increasing focus on sustainable and precision medicine.
The market for Diethoxy(methyl)phenylsilane is expected to grow steadily, driven by advancements in material science and green chemistry. Manufacturers are optimizing production processes to meet the demand for high-purity grades, while researchers continue to explore novel applications in energy storage, catalysis, and nanotechnology. Frequently searched queries such as "buy Diethoxy(methyl)phenylsilane" and "775-56-4 suppliers" indicate strong commercial interest in this compound.
From an environmental perspective, Diethoxy(methyl)phenylsilane is considered relatively stable under normal handling conditions. However, proper storage and disposal practices are essential to minimize any potential impact. The compound's hydrolytic sensitivity requires anhydrous conditions during storage, and users often search for "handling guidelines for alkoxysilanes" and "safety data sheet CAS 775-56-4" to ensure compliance with industry standards.
In conclusion, Diethoxy(methyl)phenylsilane (CAS No. 775-56-4) represents a crucial building block in modern chemistry with diverse applications across multiple industries. Its unique combination of reactivity, stability, and versatility makes it indispensable for researchers and manufacturers alike. As technology continues to evolve, this organosilicon compound is poised to play an even greater role in developing advanced materials and innovative solutions for tomorrow's challenges.
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