Cas no 681-84-5 (Tetramethoxysilane)
Tetramethoxysilane Chemical and Physical Properties
Names and Identifiers
-
- Tetramethyl orthosilicate
- Tetramethoxysilanecolorlessliq
- Methyl silicate
- DYNASIL M
- Tetramethoxysilane
- Silicon tetramethoxide
- Methyl silicate 51
- Tetramethyl silicate
- methyl orthosilicate
- O-METHYLSILICATE
- orthosilicic acid tetramethyl ester
- SILICATE,METHYL
- Tetraethoxysilane
- Tetramethosysilan
- tetramethoxy-silan
- tetramethoxy-silane
- tl190
- TMOS
- Tetramethyl orthosilicate,98%
- TETRAMETHOXYSILANE, 99+%
- TETRAMETHOXYSILANE, 97%
- Si(OMe)4
- Si(OCH3)4
- Silicic acid, tetramethyl ester
- tetramethoxy silane
- HSDB 5511
- AKOS015902512
- UN 2606
- A836042
- T0588
- 19D35VPL66
- J-524888
- Tox21_200780
- NS00041977
- Tetra-methyl orthosilicate
- TETRAMETHYL SILICATE [HSDB]
- Silicic acid, methyl ester of ortho-
- MSP 150
- SIT 7510.0
- NSC67383
- MFCD00008341
- M-Silicate 51
- UN2606
- Tetramethyl orthosilicate, >=99%
- tetramethylortho-silicate
- DTXCID207291
- Methyl Silicate 39
- Silane, tetramethoxy-
- tetramethylortho silicate
- Tetramethyl orthosilicate, purum, >=98.0% (GC)
- Tetramethyl orthosilicate, deposition grade, >=98%, >=99.9% trace metals basis
- TSL 8114
- EC 211-656-4
- Silicic acid (H4SiO4), tetramethyl ester
- TETRAMETHYL ESTER SILICATE
- WLN: 1O-SI-O1&O1&O1
- AI3-11596
- EINECS 211-656-4
- Methyl silicate ((CH3)4SiO4)
- DTXSID3027291
- TL 190
- CHEMBL3183859
- NCGC00258334-01
- Tetramethyl orthosilicate, puriss., >=99.0% (GC)
- Tetramethyl orthosilicate, 98%
- Q377159
- s15925
- NSC 67383
- UNII-19D35VPL66
- Methyl silicate, ((MeO)4Si)
- LS-13029
- F0001-1787
- 681-84-5
- CAS-681-84-5
- Methyl orthosilicate [UN2606] [Poison]
- Methyl silicate 56
- Methyl silicate 28
- Tetramethylsilikat
- Methyl silicate ((MeO)4Si)
- SCHEMBL17814
- Tetramethylsilikat [Czech]
- NCGC00248830-01
- tetramethylorthosilicate
- NSC-67383
- EN300-395310
-
- MDL: MFCD00008341
- Inchi: 1S/C4H12O4Si/c1-5-9(6-2,7-3)8-4/h1-4H3
- InChI Key: LFQCEHFDDXELDD-UHFFFAOYSA-N
- SMILES: CO[Si](OC)(OC)OC
- BRN: 1699658
Computed Properties
- Exact Mass: 152.05000
- Monoisotopic Mass: 152.05048539g/mol
- Isotope Atom Count: 0
- Hydrogen Bond Donor Count: 0
- Hydrogen Bond Acceptor Count: 4
- Heavy Atom Count: 9
- Rotatable Bond Count: 4
- Complexity: 55.5
- Covalently-Bonded Unit Count: 1
- Defined Atom Stereocenter Count: 0
- Undefined Atom Stereocenter Count : 0
- Defined Bond Stereocenter Count: 0
- Undefined Bond Stereocenter Count: 0
- Surface Charge: 0
- Tautomer Count: nothing
- XLogP3: nothing
- Topological Polar Surface Area: 36.9?2
Experimental Properties
- Color/Form: Colorless liquid with special smell and easy to deliquescence. [1]
- Density: 1.023
- Melting Point: -2 oC
- Boiling Point: 122°C
- Flash Point: 26 oC
- Refractive Index: 1.367-1.37
- Solubility: Miscible with ethanol and organic solvents. Immiscible with water.
- Water Partition Coefficient: hydrolysis
- PSA: 36.92000
- LogP: 0.00760
- Vapor Pressure: 3.35 psi ( 20 °C)
- Sensitiveness: Moisture Sensitive
- FEMA: 3185 | METHYLATED SILICA
- Solubility: Insoluble in water, miscible in most organic solvents. [9]
Tetramethoxysilane Security Information
-
Symbol:
- Prompt:dangerous
- Signal Word:Danger
- Hazard Statement: H226,H315,H318,H330,H335
- Warning Statement: P260,P280,P284,P305+P351+P338,P310
- Hazardous Material transportation number:UN 2606 6.1/PG 1
- WGK Germany:3
- Hazard Category Code: R10;R26;R37/38;R41
- Safety Instruction: S16-S26-S36/37/39-S45-S28A
- FLUKA BRAND F CODES:10-21
- RTECS:VV9800000
-
Hazardous Material Identification:
- HazardClass:6.1
- PackingGroup:I
- TSCA:Yes
- Explosive Limit:0.88-23.8%(V)
- Packing Group:I
- Hazard Level:6.1
- Safety Term:6.1
- Packing Group:I
- Risk Phrases:R10; R26; R37/38; R41
- Storage Condition:Argon filled storage
Tetramethoxysilane Customs Data
- HS CODE:29209085
- Customs Data:
China Customs Code:
2920909090Overview:
2920909090 Other inorganic esters(Esters excluding hydrogen halide)(Including its salts and their halogenation,sulfonation,Nitration and nitrosation derivatives).Regulatory conditions:nothing.VAT:17.0%.Tax refund rate:9.0%.MFN tariff:6.5%.general tariff:30.0%
Declaration elements:
Product Name, component content, use to
Summary:
2920909090 esters of other inorganic acids of non-metals (excluding esters of hydrogen halides) and their salts; their halogenated, sulphonated, nitrated or nitrosated derivatives.Supervision conditions:None.VAT:17.0%.Tax rebate rate:9.0%.MFN tariff:6.5%.General tariff:30.0%
Tetramethoxysilane Pricemore >>
| Related Categories | No. | Product Name | Cas No. | Purity | Specification | Price | update time | Inquiry |
|---|---|---|---|---|---|---|---|---|
| SHANG HAI MAI KE LIN SHENG HUA Technology Co., Ltd. | T819504-2.5kg |
Tetramethoxysilane |
681-84-5 | 98% | 2.5kg |
¥853.00 | 2022-08-31 | |
| TI XI AI ( SHANG HAI ) HUA CHENG GONG YE FA ZHAN Co., Ltd. | T0588-500G |
Tetramethyl Orthosilicate |
681-84-5 | >99.0%(GC) | 500g |
¥1390.00 | 2024-04-16 | |
| SHANG HAI JI ZHI SHENG HUA Technology Co., Ltd. | T37300-100g |
Tetramethyl orthosilicate |
681-84-5 | 100g |
¥118.0 | 2021-09-07 | ||
| SHANG HAI JI ZHI SHENG HUA Technology Co., Ltd. | T37300-500g |
Tetramethyl orthosilicate |
681-84-5 | 500g |
¥348.0 | 2021-09-07 | ||
| SHANG HAI JI ZHI SHENG HUA Technology Co., Ltd. | T37300-2.50kg |
Tetramethyl orthosilicate |
681-84-5 | 2.50kg |
¥898.0 | 2021-09-07 | ||
| SHANG HAI JI ZHI SHENG HUA Technology Co., Ltd. | T37300-50g |
Tetramethyl orthosilicate |
681-84-5 | 50g |
¥68.0 | 2021-09-07 | ||
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | T110592-100g |
Tetramethoxysilane |
681-84-5 | 98% | 100g |
¥80.90 | 2023-09-01 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | T110592-25g |
Tetramethoxysilane |
681-84-5 | 98% | 25g |
¥38.90 | 2023-09-01 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | T110592-2.5kg |
Tetramethoxysilane |
681-84-5 | 98% | 2.5kg |
¥827.90 | 2023-09-01 | |
| SHANG HAI A LA DING SHENG HUA KE JI GU FEN Co., Ltd. | T110592-500g |
Tetramethoxysilane |
681-84-5 | 98% | 500g |
¥276.90 | 2023-09-01 |
Tetramethoxysilane Suppliers
Tetramethoxysilane Related Literature
-
Sanjayan C. G.,M. S. Jyothi,R. Geetha Balakrishna J. Mater. Chem. C 2022 10 6935
-
Martin von der Lehr,Rüdiger Ellinghaus,Bernd M. Smarsly New J. Chem. 2016 40 4455
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Fei Zhang,Zhi-Feng Shi,Zhuang-Zhuang Ma,Ying Li,Sen Li,Di Wu,Ting-Ting Xu,Xin-Jian Li,Chong-Xin Shan,Guo-Tong Du Nanoscale 2018 10 20131
-
Meng Li,Xiao Zhang,Ping Yang Nanoscale 2021 13 3860
-
Cristina Fernandez-Martin,Stephen J. Roser,Karen J. Edler J. Mater. Chem. 2008 18 1222
Additional information on Tetramethoxysilane
Tetramethoxysilane: A Comprehensive Overview
Tetramethoxysilane, also known as tetramethylsilane oxide, is a versatile organosilicon compound with the CAS number 681-84-5. This compound, often abbreviated as TMOS, has garnered significant attention in recent years due to its wide-ranging applications in various industries. The tetramethoxysilane molecule consists of a silicon atom surrounded by four methoxy groups (-OCH3), making it a key player in the field of organosilicon chemistry.
One of the most notable aspects of tetramethoxysilane is its role as an intermediate in the synthesis of other silicon-based compounds. Recent studies have highlighted its potential in the production of high-performance materials, such as advanced ceramics and composites. The ability of tetramethoxysilane to undergo hydrolysis and condensation reactions has made it invaluable in the development of silica-based materials with tailored properties.
The chemical properties of tetramethoxysilane are closely tied to its molecular structure. Its low molecular weight and high volatility make it suitable for applications requiring precise control over reaction conditions. Researchers have explored the use of tetramethoxysilane in sol-gel processes, where it serves as a precursor for the formation of nanostructured silica. These nanostructures have found applications in optics, catalysis, and drug delivery systems.
In terms of industrial applications, tetramethoxysilane is widely used in the electronics industry as a precursor for the deposition of thin films. Recent advancements in semiconductor manufacturing have emphasized the importance of tetramethoxysilane in achieving high-quality dielectric layers. Its ability to form uniform films at relatively low temperatures has made it a preferred choice for next-generation electronic devices.
The environmental impact of tetramethoxysilane has also been a topic of interest. Studies have shown that its decomposition products are non-toxic and biodegradable, making it a safer alternative to other organosilicon compounds. This eco-friendly profile aligns with current trends toward sustainable chemistry and green manufacturing.
From a research perspective, tetramethoxysilane continues to be a focal point for exploring novel chemical reactions and material properties. Its reactivity with various functional groups has opened avenues for the synthesis of hybrid materials with enhanced mechanical and thermal stability. Recent breakthroughs in click chemistry have further expanded the potential applications of tetramethoxysilane, particularly in the development of self-healing polymers.
In conclusion, tetramethoxysilane stands out as a multifaceted compound with significant contributions across diverse fields. Its unique chemical properties, coupled with its versatility in synthesis and application, position it as a cornerstone material for future technological advancements. As research into tetramethoxysilane continues to evolve, its role in shaping innovative solutions will undoubtedly grow even more prominent.
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